In-Person Meeting Technical Committees A, B, D and E

Detroit, Michigan, USA

The Technical Committees  A (Physical layer) and Technical Committee B (Data Link Layer & Application Stream Encapsulation Protocol (ASEP))

as well  Technical Committee D (Test) and Technical Committee E (Channel &  Components, EMC Tests) will meet for an in-person meeting in

Detroit, Michigan during October 14th – 15th.

Members only event.

In-person registration will open soon.

For any questions please get in contact with respective TC Chair or TC Vice Chair.